Analysis of Residual Stress at the Curing Interface of Epoxy Resin Impregnated Paper for Dry-Type Bushing

Author:

Wang Chuang1,Li Xu1,Chen Chi1,Zhang Zaiqin1,Bu Yue1,Gao Qingqing1

Affiliation:

1. School of Electrical Engineering, Xi'an University of Technology,Xi'an,China

Funder

National Natural Science Foundation of China

Publisher

IEEE

Reference11 articles.

1. Experimental and simulation study on cure-induced distortion of Epoxy Composite used in GIL Insulators;Wu;High. Voltage. Engineering,2021

2. Numerical simulation of the interfacial stress between epoxy resin and metal conductor of power equipment during epoxy curing

3. A review of numerical simulation of cure-induced distortions and residual stresses in thermoset composites;Ding;Acta. Materiae. Compositae. Sinica,2017

4. Simulation study on stress distribution of 1100kV GIS Insulator during curing;Chen

5. Influence factors of residual stress in Epoxy Resin/Anhydride insulating material curing system;Zhao;Insulating. Materials,2019

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