Integration schemes and enabling technologies for three-dimensional integrated circuits
Author:
Publisher
Institution of Engineering and Technology (IET)
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Software
Link
https://digital-library.theiet.org/content/journals/10.1049/iet-cdt.2009.0127?crawler=true&mimetype=application/pdf
Reference41 articles.
1. Cramming More Components Onto Integrated Circuits
2. Is 3D chip technology the next growth engine for performance improvement?
3. International Technology Roadmap for Semiconductors (ITRS): 2004 Edition and updates
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