Cooling as a possible way to extend the usability of IDDQ testing
Author:
Publisher
Institution of Engineering and Technology (IET)
Subject
Electrical and Electronic Engineering
Link
https://digital-library.theiet.org/content/journals/10.1049/el_19971406?crawler=true&mimetype=application/pdf
Reference2 articles.
1. Deep sub-micron I/sub DDQ/ testing: issues and solutions
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1. Temperature dependence of IDDQ distribution: application for thermal delta IDDQ testing;IET Circuits, Devices & Systems;2007
2. I DDX -based test methods;ACM Transactions on Design Automation of Electronic Systems;2004-04
3. IDDQ data analysis using neighbor current ratios;Journal of Systems Architecture;2004-04
4. Impact of technology scaling on thermal behavior of leakage current in sub-quarter micron MOSFETs: perspective of low temperature current testing;Microelectronics Journal;2002-11
5. Introduction to the testing of integrated circuits;Thermal Testing of Integrated Circuits;2002
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