Proposed configuration of integrated optical isolator employing wafer-direct bonding technique
Author:
Publisher
Institution of Engineering and Technology (IET)
Subject
Electrical and Electronic Engineering
Link
https://digital-library.theiet.org/content/journals/10.1049/el_19971253?crawler=true&mimetype=application/pdf
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1. Wafer bonding for silicon‐on‐insulator technologies
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4. Electrical characteristics of directly‐bonded GaAs and InP
5. Direct Bonding of $\bf LiTaO_{3}$ Single Crystals
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