Ultimate noise isolation in high‐speed digital systems on packages and printed circuit boards
Author:
Affiliation:
1. IBM Systems and Technology GroupIBM CorporationAustinTX78758USA
Publisher
Institution of Engineering and Technology (IET)
Subject
Electrical and Electronic Engineering
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1049/el.2012.4303
Reference8 articles.
1. Modeling and analysis of power distribution networks for gigabit applications;Choi J.;IEEE Trans. Mob. Comput.,2003
2. Microelectronics Packaging Handbook
3. Electrical Design of a High Speed Computer Package
4. Noise Isolation in Mixed-Signal Systems Using Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure-Based Power Distribution Network (PDN)
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3. A Compact and Multi-Stack Electromagnetic Bandgap Structure for Gigahertz Noise Suppression in Multilayer Printed Circuit Boards;Applied Sciences;2017-08-07
4. Novel Subregional Embedded Electromagnetic Bandgap Structure for SSN Suppression;IEEE Transactions on Components, Packaging and Manufacturing Technology;2016-04
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