Novel Subregional Embedded Electromagnetic Bandgap Structure for SSN Suppression

Author:

Shi Ling-Feng,Zhang Gen,Jin Meng-Meng,Chen Sen,Hu Xiu-Jie

Funder

Key Laboratory of High-Speed Circuit Design through the EMC Foundation of China

Fundamental Research Funds for the Central Universities, China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. A Dual-Band Mushroom EBG Structure With Inductive via Coupling for Wideband Parallel-Plate Mode Suppression;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-06

2. Analysis and Applications of Electromagnetic Bandgap Metasurfaces;Electromagnetic Metamaterials and Metasurfaces: From Theory To Applications;2024

3. Enhanced Signal and Power Integrity using Novel Planar EBG design;2023 Joint Asia-Pacific International Symposium on Electromagnetic Compatibility and International Conference on ElectroMagnetic Interference & Compatibility (APEMC/INCEMIC);2023-05-23

4. Simultaneous switching noise mitigation in high speed pcb using novel planar EBG structure;International Journal of Electronics;2022-06-03

5. Power Integrity Analysis of Power Distribution Network Segmented Using DGS–Electromagnetic Bandgap Structure in Mixed-Signal PCBs;Electronics;2020-12-01

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