Damage effects in Pyrex by CF4 reactive ion etching in dual RF-microwave plasmas-Reference-Cited by-同舟云学术

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Damage effects in Pyrex by CF4 reactive ion etching in dual RF-microwave plasmas

Published:2006 Issue:2 Volume:1 Page:103
ISSN:1750-0443
Container-title:Micro & Nano Letters
language:en
Short-container-title:Micro Nano Lett.

Author:

Zeze D.A.,Carey J.D.,Stolojan V.,Weiss B.L.,Silva S.R.P.

Publisher

Institution of Engineering and Technology (IET)

Subject

Condensed Matter Physics,General Materials Science,Biomedical Engineering,Bioengineering

Link

https://digital-library.theiet.org/content/journals/10.1049/mnl_20065059?crawler=true&mimetype=application/pdf

Reference20 articles.

1. Microwave loss of coplanar waveguides on electrically ion depleted borosilicate glass

2. Future prospects for dry etching

3. Plasma processing damage in etching and deposition

4. High mass positive ions and molecules in capacitively-coupled radio-frequency CF4 plasmas

5. Influence of temperature on the etching rate of SiO2 in CF4+O2 plasma

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Necking Reduction at Low Temperature in Aspect Ratio Etching of SiO2 at CF4/H2/Ar Plasma;Nanomaterials;2024-01-17

2. Deep dry etching of fused silica using C4F8/Ar inductively coupled plasmas;Journal of Materials Science: Materials in Electronics;2016-08-20

3. Effect of RF plasma exposure on silver nanoparticle layer;Microsystem Technologies;2015-06-16

4. Investigation of fused silica glass etching using C4F8/Ar inductively coupled plasmas for through glass via (TGV) applications;Microsystem Technologies;2015-02-04

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