Finite element modelling of thermal fatigue effects in IGBT modules-Reference-Cited by-同舟云学术

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Finite element modelling of thermal fatigue effects in IGBT modules

Published:2001 Issue:2 Volume:148 Page:95
ISSN:1350-2409
Container-title:IEE Proceedings - Circuits, Devices and Systems
language:en
Short-container-title:IEE Proc., Circuits Devices Syst.

Author:

Shammas N.Y.A.,Rodriguez M.P.,Plumpton A.T.,Newcombe D.

Publisher

Institution of Engineering and Technology (IET)

Subject

Electrical and Electronic Engineering

Link

https://digital-library.theiet.org/content/journals/10.1049/ip-cds_20010293?crawler=true&mimetype=application/pdf

Reference14 articles.

1. Failure analysis of power modules: a look at the packaging and reliability of large IGBTs

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal Performance Optimization of Integrated Microchannel Cooling Plate for IGBT Power Module;Micromachines;2023-07-26

2. Temporal and Spatial Differences in Thermal Transfer Behavior of IGBTs Caused by the Baseplate and Die-Attach Solder Cracking;IEEE Journal of Emerging and Selected Topics in Power Electronics;2022-12

3. Non-Contact Degradation Evaluation for IGBT Modules Using Eddy Current Pulsed Thermography Approach;Energies;2020-05-21

4. Gate–Emitter Pre-threshold Voltage as a Health-Sensitive Parameter for IGBT Chip Failure Monitoring in High-Voltage Multichip IGBT Power Modules;IEEE Transactions on Power Electronics;2019-09

5. FE Based Thermal Analysis of Void Effect in IGBT Mechanical Module;Advanced Materials Research;2012-07

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