Thermodynamic Re-Assessment of the Ag-Ni-Sn System
Author:
Publisher
Elsevier BV
Subject
General Earth and Planetary Sciences,General Environmental Science
Reference101 articles.
1. Low-cycle fatigue behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi lead-free solders;C Kanchanomai;J. Electron. Mater,2002
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3. Kinetics of Ag 3 Sn growth in Ag-Sn-Ag system during transient liquid phase soldering process;J F Li;Acta Mater,2010
4. Tensile properties of Sn-Ag based lead-free solders and strain rate sensitivity;I Shohji;Materials Science and Engineering: A,2004
5. Minimum effective Ni addition to SnAgCu solders for retarding Cu 3 Sn growth;Y W Wang;J. Alloys Compd,2009
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