Surface tension and density of liquid Sn–Ag–Cu alloys
Author:
Affiliation:
1. Institute of Metallurgy and Materials Science, Polish Academy of Sciences, Krakow, Poland
2. Foundry Research Institute, Krakow, Poland
Abstract
Publisher
Walter de Gruyter GmbH
Subject
Materials Chemistry,Metals and Alloys,Physical and Theoretical Chemistry,Condensed Matter Physics
Link
https://www.degruyter.com/document/doi/10.3139/146.110819/pdf
Reference34 articles.
1. Wetting in Soldering and Microelectronics
2. Factors affecting wettability and bond strength of solder joint couples
3. Surface-tension measurements of the eutectic alloy (Ag-Sn 96.2 at.%) with Cu additions
4. Experimental and Theoretical Study of the Surface Tension in Liquid Ag–Cu–Sn Alloys
5. Surface tension and density in liquid Ag–Cu–Sn alloys
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