Affiliation:
1. 1Foundry Research Institute, 73 Zakopianska Street, 30-418 Cracow, Poland
2. 2Motor Transport Institute, 88 Jagiellonska Street, 03-391 Warsaw, Poland
Abstract
The paper discusses the scientific understanding of the role of interfacial phenomena in joining of dissimilar materials using liquid-phase-assisted processes. From the example of the Sn-alloy/Cu system, it is demonstrated that interaction in the liquid solder/substrate couples is accompanied by a number of complex interfacial reactions leading to significant changes in the structure and chemistry of interfaces (solder/substrate, solder/environment, substrate/environment) and remaining solder layer that finally influence the mechanical properties of solder joints. The experimental data on wetting behavior, interface characterization, and mechanical properties of different solder/metal substrate couples are analyzed in order to display the role of such factors as time and temperature of interaction, environment (protective atmosphere, flux), presence of oxide films on interfaces, alloying additions to a solder, formation of interfacial phases, and porosity.
Subject
General Chemical Engineering,General Chemistry
Reference31 articles.
1. Friendly Lead free Technology Publications;Hwang;Environment Electronics,2001
2. Report Space;Sutton;Sciences Lab USA,1964
Cited by
38 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献