Affiliation:
1. Joining and Welding Research Institute, Osaka University, Osaka 567-0047, Japan;,
Abstract
Wettability of solid metals by molten solders is reviewed. The contact angle and wetting force are tabulated for various combinations of solid metals and molten solders such as Sn-Pb base alloys, Sn-Ag base alloys, Sn-Zn base alloys, Sn-Cu base alloys, and Sn-Bi base alloys. Studies on the wetting rate are also discussed.
Subject
General Materials Science
Cited by
47 articles.
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