Characterization of Intermetallic Compounds Formed during the Interfacial Reactions of Liquid Sn and Sn-58Bi Solders with Ni Substrates
Author:
Publisher
Walter de Gruyter GmbH
Subject
Metals and Alloys
Reference11 articles.
1. The mechanical properties and microstructures of copper and brass joints soldered with eutectic tin-bismuth solder
2. Characterization of eutectic Sn-Bi solder joints
3. The effect of aging on microstructure, room temperature deformation, and fracture of Sn-Bi/Cu solder joints
4. The Attainment of Reliability in Modern Soldering Techniques for Electronic Assemblies
5. Long-term aging study on the solid-state reaction between 58Bi42Sn solder and Ni substrate
Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Influence of Pad Surface Finish on the Microstructure Evolution and Intermetallic Compound Growth in Homogeneous Sn-Bi and Sn-Bi-Ag Solder Interconnects;Journal of Electronic Materials;2021-10-13
2. Diffusion couple studies of the Ni-Bi-Sn system;Journal of Mining and Metallurgy, Section B: Metallurgy;2012
3. Effect of La addition on the interfacial intermetallics and bonding strengths of Sn–58Bi solder joints with Au/Ni/Cu pads;Journal of Alloys and Compounds;2010-02
4. Intermetallic Reactions in Sn-0.4Co-0.7Cu Solder BGA Packages with an ENIG Surface Finish;Journal of Electronic Materials;2008-08-21
5. Intermetallic Reactions in Reflowed and Aged Sn-58Bi BGA Packages with Au/Ni/Cu Pads;Journal of Materials Engineering and Performance;2007-08-08
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