Intermetallic Reactions in Sn-0.4Co-0.7Cu Solder BGA Packages with an ENIG Surface Finish-Reference-Cited by-同舟云学术

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Intermetallic Reactions in Sn-0.4Co-0.7Cu Solder BGA Packages with an ENIG Surface Finish

Published:2008-08-21 Issue:11 Volume:37 Page:1734-1741
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Chuang T.H.,Jain C.C.,Wu H.M.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-008-0501-9.pdf

Reference16 articles.

1. K. Zeng, K.N. Tu. (2002) Mater. Sci. Eng. R38, 55

2. L.B. Liu, C. Andersson, J. Liu, Y.C. Chan, Interpack 2003–35126, Int. Electronic Packaging Technical Conf. Exhib. (New York: ASME, 2003), pp. 141–146

3. L.B. Liu, C. Andersson, J. Liu. (2004) J. Electron. Mater. 33, 935. doi: 10.1007/s11664-004-0019-8

4. C. Andersson, P. Sun, and J. Liu, J. Alloys Compd. 457, 97 (2008)

5. P. Sun, C. Andersson, X. Wei, Z. Cheng, D. Shangguan, J. Liu (2006) Mater. Sci. Eng. B 135, 134. doi: 10.1016/j.mseb.2006.08.051

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1. Effect of Ni(P) thickness in Au/Pd/Ni(P) surface finish on the electrical reliability of Sn–3.0Ag–0.5Cu solder joints during current-stressing;Journal of Alloys and Compounds;2021-01

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4. Study of the Structure and Hardness of Alloys of the Sn – Cu – Co System Used as Diamond Abrasive Tool Binders;Metal Science and Heat Treatment;2017-09

5. Correlation between interfacial microstructure and bonding strength of sintered nanosilver on ENIG and electroplated Ni/Au direct-bond-copper (DBC) substrates;Journal of Alloys and Compounds;2016-08

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