Forced Convective Heat Transfer from a Channel Between Vertical Electronic Circuit Boards.
Author:
Affiliation:
1. Department of Biological & Chemical Engineering, Gunma University
Publisher
Society of Chemical Engineers, Japan
Subject
General Chemical Engineering,General Chemistry
Link
http://www.jstage.jst.go.jp/article/jcej/29/6/29_6_960/_pdf
Reference5 articles.
1. Parametric study of turbulent three-dimensional heat transfer of arrays of heated blocks encountered in electronic equipment
2. Local forced convective heat transfer from protruding and flush-mounted two-dimensional discrete heat sources
3. Oktay, C., R. Hannemann and A. Bar-Cohen; “High Heat from a Small Package,” Mech. Engng, 108, 36–42 (1986)
4. Sparrow, E. M., A. A. Yanezmoreno and D. R. Otis; “Convective Heat Transfer Response to Height Differences in an Array of Block-Like Electronic Equipments,” Int. J. Heat Mass Transfer, 28, 469–473 (1984)
5. Heat transfer and pressure drop characteristics of arrays of rectangular modules encountered in electronic equipment
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1. Thermal Analysis in a Channel Between Vertical Electronic Circuit Boards Cooled by Forced Convection.;JOURNAL OF CHEMICAL ENGINEERING OF JAPAN;1996
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