Heat transfer and pressure drop characteristics of arrays of rectangular modules encountered in electronic equipment-Reference-Cited by-同舟云学术

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Heat transfer and pressure drop characteristics of arrays of rectangular modules encountered in electronic equipment

Published:1982-07 Issue:7 Volume:25 Page:961-973
ISSN:0017-9310
Container-title:International Journal of Heat and Mass Transfer
language:en
Short-container-title:International Journal of Heat and Mass Transfer

Author:

Sparrow E.M.,Niethammer J.E.,Chaboki A.

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference5 articles.

1. Cooling Electronic Equipment;Kraus,1965

2. The evolution of cooling technology for electrical equipment and electronic devices;Bergles,1977

3. Sublimation from discs to air streams flowing normal to their surfaces;Sogin;Trans. ASME,1958

4. Heat transfer from tubes in crossflow;Zukauskas,1972

5. Analogies to heat transfer processes;Eckert,1976

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