1. Heat transfer and pressure drop characteristics of arrays of rectangular modules encountered in electronic equipment;Sparrow;Int. J. Heat Mass Transfer,1982
2. Convection from surface mounted repeating ribs in a channel flow;Lehmann,1984
3. The effect of variations in stream-wise spacing and length on convection from surface mounted rectangular components;Lehmann,1985
4. Cooling electronic components: forced convection experiments with an air-cooled array;Moffat,1985
5. The use of superposition in calculating cooling requirements for circuit board mounted electronic components;Moffat;IEEE Paper CH 1781-4/82/0000-b133,1982