Physics and tribology of chemical mechanical planarization
Author:
Publisher
IOP Publishing
Subject
Condensed Matter Physics,General Materials Science
Link
http://stacks.iop.org/0953-8984/20/i=22/a=225011/pdf
Reference103 articles.
1. A Tribochemical Study of Ceria-Silica Interactions for CMP
2. Ultraprecision grinding technologies in silicon semiconductor processing
3. A Model for Mechanical Wear and Abrasive Particle Adhesion during the Chemical Mechanical Polishing Process
4. Effect of Hydrogen Peroxide on Oxidation of Copper in CMP Slurries Containing Glycine
5. Contact and Rubbing of Flat Surfaces
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