Subject
Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Cited by
10 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. The influence of sub-surface damage microstructure on ultra-thin die flexural strength;Journal of Materials Research and Technology;2024-07
2. A review of laser ablation and dicing of Si wafers;Precision Engineering;2022-01
3. A More Than Moore Enabling Wafer Dicing Technology;2019 IEEE 69th Electronic Components and Technology Conference (ECTC);2019-05
4. Advanced Electronic Packaging;Modeling and Application of Flexible Electronics Packaging;2019
5. Measurement of Fracture Strength of Ultra-thin Silicon Chip and Adhesive Fracture Energy;Modeling and Application of Flexible Electronics Packaging;2019