Measurement of Fracture Strength of Ultra-thin Silicon Chip and Adhesive Fracture Energy
Author:
Publisher
Springer Singapore
Link
http://link.springer.com/content/pdf/10.1007/978-981-13-3627-0_3
Reference31 articles.
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3. Zhang T-Y, Su Y-J, Qian C-F, Zhao M-H, Chen L-Q (2000) Microbridge testing of silicon nitride thin films deposited on silicon wafers. Acta Mater 48(11):2843–2857
4. Wu J, Huang C, Liao C (2003) Fracture strength characterization and failure analysis of silicon dies. Microelectron Reliab 43(2):269–277
5. Paul I, Majeed B, Razeeb K, Barton J (2006) Statistical fracture modelling of silicon with varying thickness. Acta Mater 54(15):3991–4000
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