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Large-area patterning of multilayered green ceramic substrates using micro roller embossing

  • Published:2008-04-29 Issue:6 Volume:18 Page:065007
  • ISSN:0960-1317
  • Container-title:Journal of Micromechanics and Microengineering
  • language:
  • Short-container-title:J. Micromech. Microeng.

Author:

Shan Xuechuan,Soh Y C,Shi C W P,Tay C K,Chua K M,Lu C W

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Cited by 16 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Enhanced hot embossing processes;Hot Embossing;2024

2. LTCC-based Ceramic Substrates for Identification of Trustworthy Electronics;2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC);2023-09-11

3. A review on modelling and numerical simulation of micro hot embossing process: fabrication, mold filling behavior, and demolding analysis;Engineering Research Express;2023-03-01

4. Current innovations in roller embossing—a comprehensive review;Microsystem Technologies;2022-03-10

5. Hot Embossing of polymers – A review;Materials Today: Proceedings;2020
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