A review on modelling and numerical simulation of micro hot embossing process: fabrication, mold filling behavior, and demolding analysis

Abstract

AbstractMicro-hot embossing (micro-HE) of polymeric materials creates exact micro/nanoscale designs. Micro-HE processes include plate-to-plate (P2P), roll-to-roll (R2R), and roll-to-plate (R2P). Micro-HE is preferred for large-scale production of micro-patterns on polymer substrates. However, the lack of simulation models for optimization and component design prevents the broad use of this technology. As the size of the micro patterns decreases from micron to sub-micron, it improves performance features. Micro-HE cannot be analyzed using software tools like injection molding since there is no macroscopic equivalent. Commercial simulation software covers injection molding and associated processes. No commercial tool covers all micro-HE process steps, variations, and boundary conditions. According to the author, such review articles are not in the literature. This article summarizes the simulation work in the micro-HE process field related to replication accuracy, mold filling behaviour. In addition to this various models were discussed based on properties of material, based on various forces participate in the HE process, and gives a detailed idea about mold-filling behavior and demolding analysis. Finally, challenges and future scope related to modelling and simulation work in field of hot embossing has been presented.