Characterization of masking materials for deep glass micromachining-Reference-Cited by-同舟云学术

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Characterization of masking materials for deep glass micromachining

Published:2003-06-13 Issue:4 Volume:13 Page:S34-S40
ISSN:0960-1317
Container-title:Journal of Micromechanics and Microengineering
language:
Short-container-title:J. Micromech. Microeng.

Author:

Bien D C S,Rainey P V,Mitchell S J N,Gamble H S

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. Deep wet etching of fused silica glass for hollow capillary optical leaky waveguides in microfluidic devices

2. Method for fabrication of microfluidic systems in glass

3. Polymerization optimization of SU-8 photoresist and its applications in microfluidic systems and MEMS

Cited by 71 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A study on chromium thin film with positive photoresist as a masking layer towards the wet bulk micromachining of Borofloat glass;Micro and Nano Systems Letters;2024-07-08

2. Eco‐friendly glass wet etching for MEMS application: A review;Journal of the American Ceramic Society;2024-07-02

3. Enhancement of Glass micromachining using selective copper electroplating;2023 16th International Conference on Sensing Technology (ICST);2023-12-17

4. Additive, subtractive and formative manufacturing of glass-based functional micro/nanostructures: A comprehensive review;Materials & Design;2023-09

5. Etching of micro-channels in fused quartz for novel device applications;Materials Today: Proceedings;2023-08

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