Wafer-level Au–Au bonding in the 350–450 °C temperature range-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Wafer-level Au–Au bonding in the 350–450 °C temperature range

Published:2014-07-22 Issue:8 Volume:24 Page:084002
ISSN:0960-1317
Container-title:Journal of Micromechanics and Microengineering
language:
Short-container-title:J. Micromech. Microeng.

Author:

Tofteberg Hannah R,Schjølberg-Henriksen Kari,Fasting Eivind J,Moen Alexander S,Taklo Maaike M V,Poppe Erik U,Simensen Christian J

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://stacks.iop.org/0960-1317/24/i=8/a=084002/pdf

Reference24 articles.

1. Glass frit bonding: an universal technology for wafer level encapsulation and packaging

2. Single crystalline silicon based surface micromachining for high precision inertial sensors: technology and design for reliability

3. Handbook of Wafer Bonding

4. Field Assisted Glass‐Metal Sealing

Cited by 27 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Plasma activated titanium-based bonding for robust and reliable Si–Si and Si-glass integration;Ceramics International;2024-07

2. Approaches to Heterogeneous Integration for Millimeter-Wave Applications;Journal of the Russian Universities. Radioelectronics;2023-09-29

3. Indirect bonding of MgO wafers based on intercalation crystallisation of amorphous MgO film;Surfaces and Interfaces;2023-08

4. Nanoelectromechanical Tuning of High-Q Slot Metasurfaces;Nano Letters;2023-06-12

5. Room temperature bonding of Au assisted by self-assembled monolayer;Applied Physics Letters;2023-01-30

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3