Glass frit bonding: an universal technology for wafer level encapsulation and packaging-Reference-Cited by-同舟云学术

Glass frit bonding: an universal technology for wafer level encapsulation and packaging

Published:2005-10-18 Issue:1-2 Volume:12 Page:63-68
ISSN:0946-7076
Container-title:Microsystem Technologies
language:en
Short-container-title:Microsyst Technol

Author:

Knechtel Roy

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s00542-005-0022-x.pdf

Reference5 articles.

1. MEMS and Sensor Materials 11–036 Sealing glass (2002) Specification FERRO Electronic Materials Santa Babara, Ca, Rev. 1200

2. HVG Fortbildungskurs (1995) Fügen von Glas. Verlag der Deutschen Glastechnischen Gesellschaft Frankfurt Main 1995 ISBN 3-921089-14-X

3. Zinke A (1961) Technologie der Glasverschmelzungen. Technisch-physikalische Monographien Band 12, Leipzig 1996 Akademische Verlagsgesellschaft Geest und Portig K.-G

4. Knechtel R, Heller J, Wiemer M, Frömel J (2003) “Silicon wafer bonding for encapsulating surface micromechanical systems using intermediate glass layers. In: Semiconductor wafer bonding VII, science, technology and applications, proceedings of the 203rd meeting ECS, Paris

5. Knechtel R (2003) Wafer level encapsulation of surface micromechanical sensors demands and solution. In: Proceedings of the micro system technologies, München

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