On the origin of selectivity and anisotropy loss during microstructure release etch
Author:
Publisher
IOP Publishing
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Reference33 articles.
1. Laminated high-aspect-ratio microstructures in a conventional CMOS process
2. A new approach for the fabrication of micromechanical structures
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