Author:
Fedder G.K.,Santhanam S.,Reed M.L.,Eagle S.C.,Guillou D.F.,Lu M.S.-C.,Carley L.R.
Subject
Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Reference13 articles.
1. A new approach for the fabrication of micromechanical structures;Parameswaran;Sensors and Actuators,1989
2. Micromechanics compatible with an 0.8 μm CMOS process;Biebl;Sensors and Actuators A,1995
3. Influence of design geometry and packaging on the response of thermal CMOS flow sensors;Mayer,1995
4. A piezoresistive silicon accelerometer with monolithically integrated CMOS-circuitry;Seidel,1995
5. Thermally and electrically isolated single crystal silicon structures in CMOS technology;Reay;IEEE Electron Device Lett.,1994
Cited by
131 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献