A low temperature surface modification assisted method for bonding plastic substrates-Reference-Cited by-同舟云学术

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A low temperature surface modification assisted method for bonding plastic substrates

Published:2008-11-27 Issue:1 Volume:19 Page:015007
ISSN:0960-1317
Container-title:Journal of Micromechanics and Microengineering
language:
Short-container-title:J. Micromech. Microeng.

Author:

Vlachopoulou M-E,Tserepi A,Pavli P,Argitis P,Sanopoulou M,Misiakos K

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference19 articles.

1. Microfluidic devices fabricated in Poly(dimethylsiloxane) for biological studies

2. Microfluidics meets MEMS

3. Polymer microfabrication methods for microfluidic analytical applications

4. Polymer microfluidic devices

5. Low-pressure, high-temperature thermal bonding of polymeric microfluidic devices and their applications for electrophoretic separation

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