How thin barrier metal can be used to prevent Co diffusion in the modern integrated circuits?
Author:
Publisher
IOP Publishing
Subject
Surfaces, Coatings and Films,Acoustics and Ultrasonics,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
http://iopscience.iop.org/article/10.1088/1361-6463/aa8934/pdf
Reference30 articles.
1. Patterning of narrow porous SiOCH trenches using a TiN hard mask
2. Two-level BEOL processing for rapid iteration in MRAM development
3. Investigation of a Promising Chemical for BEOL Ultra Low K Cleaning of 28nm Node and Beyond
4. Industrial Challenges of TiN Hard Mask Wet Removal Process for 14nm Technology Node
5. Study of low temperature MOCVD deposition of TiN barrier layer for copper diffusion in high aspect ratio through silicon vias
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