Effects of copper content in Sn-based solder on the intermetallic phase formation and growth during soldering
Author:
Publisher
IOP Publishing
Subject
General Medicine
Link
http://stacks.iop.org/1757-899X/361/i=1/a=012008/pdf
Reference22 articles.
1. An effective diffusion barrier metallization process on copper
2. Effect of Ag on Sn–Cu and Sn–Zn lead free solders
3. Effect of volume in interfacial reaction between eutectic Sn–Pb solder and Cu metallization in microelectronic packaging
4. Concurrent nucleation, formation and growth of two intermetallic compounds (Cu6Sn5 and Cu3Sn) during the early stages of lead-free soldering
5. Effect of TiO 2 additions on Sn-0.7Cu-0.05Ni lead-free composite solder
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1. Effects of trace addition of Fe on the thermal, microstructure, and tensile creep properties of Sn-0.7Cu eutectic alloy;Journal of Materials Science: Materials in Electronics;2024-04
2. Sn-3.0Ag-0.5Cu Solder Enriched with Tb4O7 Nanoparticles for Mini-Light Emitting Diode Packaging;ACS Applied Nano Materials;2024-01-16
3. Nucleation and Location of Kirkendall Voids at the Tin‐Based Solder/Copper Joint: A Review;Advanced Engineering Materials;2023-07-26
4. Effect of multi-walled carbon nanotubes on the microstructure and properties of Sn-58Bi solder alloys;Journal of Adhesion Science and Technology;2023-06-21
5. Micro‐Particle Induced X‐ray Emission Study of Lead‐Free and Lead‐Based Solders and Interactions with Copper Wires;physica status solidi (a);2023-01-04
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