Monitoring of properties of epoxy molding compounds used in electronics for protection and hermetic sealing of microcircuits

Abstract

Abstract It is known that epoxy molding compounds have a significant impact on productivity, service life and reliability of electronic microcircuit components. Wrong choice of a molding mixture can lead to mechanical stresses, deformation, cracking or lamination of the protective packaging followed by microcircuit breakage. The study summarizes information on composition, main operating characteristics and application methods of epoxy molding compounds as well as their impact on microcircuit shape distortion. Main methods for control of physical and mechanical properties of epoxy molding compounds with the most significant impact on microcircuit hermetic sealing and on formation of different kinds of defects in the protective packing.