Elucidation of Adhesive Interaction between the Epoxy Molding Compound and Cu Lead Frames
Author:
Affiliation:
1. Research and Development Center, ROHM Co., Ltd., 21 Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan
2. Institute for Materials Chemistry and Engineering and IRCCS, Kyushu University, 744 Motooka, Nishi-ku, Fukuoka 819-0395, Japan
Funder
Core Research for Evolutional Science and Technology
Japan Society for the Promotion of Science
Japan Science and Technology Agency
Publisher
American Chemical Society (ACS)
Subject
General Chemical Engineering,General Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/acsomega.1c05914
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3. Thermally conductive EMC (epoxy molding compound) for microelectronic encapsulation
4. Garete, A. J.; Li, Z.; Taduran, A. Epoxy molding compound development for improved MSL1 delamination resistance in plastic encapsulated clip bond power package. Electronics Packaging Technology Conference, 2020; pp 90–94.
5. Bioinspired structural color patch with anisotropic surface adhesion
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