Effect of fibre-lasers parameters on interfacial reaction and wetting angle of two different types of SAC305 solder fabrication on Cu pad
Author:
Publisher
IOP Publishing
Subject
General Medicine
Link
http://stacks.iop.org/1757-899X/469/i=1/a=012117/pdf
Reference33 articles.
1. Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints
2. Effects of laser parameters on the characteristics of a Sn-3.5 wt.%Ag solder joint
3. Effect of TiO 2 additions on Sn-0.7Cu-0.05Ni lead-free composite solder
4. Experimental and theoretical analysis of the classification of Sn0.3Ag0.7Cu lead-free solders powder
Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A review: effect of copper percentage solder alloy after laser soldering;Soldering & Surface Mount Technology;2022-12-01
2. A Simulation Study on Interfacial Reaction Between Sn3Ag0.5Cu and Sn0.7Cu Using Different Substrates After Reflow Soldering;Technological Advancement in Mechanical and Automotive Engineering;2022-08-09
3. A data-driven framework to predict the morphology of interfacial Cu6Sn5 IMC in SAC/Cu system during laser soldering;Journal of Materials Science & Technology;2020-08
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