Effect of Different Amount of Silicon Carbide on SAC Solder-Cu Joint Performance by Using Microwave Hybrid Heating Method
Author:
Publisher
IOP Publishing
Subject
General Medicine
Link
http://stacks.iop.org/1757-899X/469/i=1/a=012110/pdf
Reference19 articles.
1. Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints
2. IMC morphology, interfacial reaction and joint reliability of Pb-free Sn–Ag–Cu solder on electrolytic Ni BGA substrate
3. The growth and roughness evolution of intermetallic compounds of Sn–Ag–Cu/Cu interface during soldering reaction
4. Novel Application of Diffusion Soldering*
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Effect of Microwave Hybrid Heating on Mechanical Properties and Microstructure of Sn3.0Ag0.5Cu/Cu Solder Joints;International Journal of Automotive and Mechanical Engineering;2023-10-17
2. Microwave Hybrid Heating as an Alternative Method for Soldering—A Brief Review;Technological Advancement in Mechanical and Automotive Engineering;2022-08-09
3. Comparison of intermetallic compound growth and tensile behavior of Sn-3.0Ag-0.5Cu/Cu solder joints by conventional and microwave hybrid heating;Journal of Materials Research and Technology;2022-03
4. Effect of microwave operating power and reflow time on the microstructure and tensile properties of Sn–3.0Ag–0.5Cu/Cu solder joints;Soldering & Surface Mount Technology;2021-07-28
5. Computational analysis of hybrid heating of a heterogeneous core-shell configuration for improving temperature uniformity;Respuestas;2021-04-30
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