Characterization of thermal treatment effects on thermal and electrical stability of low-k material
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Published:2010-02-01
Issue:
Volume:8
Page:012039
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ISSN:1757-899X
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Container-title:IOP Conference Series: Materials Science and Engineering
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language:
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Short-container-title:IOP Conf. Ser.: Mater. Sci. Eng.
Author:
Choi B H,Kim Y B,Lee J H