Influence of multi-walled carbon nanotubes on melting temperature and microstructural evolution of Pb-free Sn-5Sb/Cu solder joint
Author:
Publisher
IOP Publishing
Subject
General Medicine
Link
http://stacks.iop.org/1757-899X/238/i=1/a=012010/pdf
Reference18 articles.
1. Investigating the effect of isothermal aging on the morphology and shear strength of Sn-5Sb solder reinforced with carbon nanotubes
2. Improving the performance of lead-free solder reinforced with multi-walled carbon nanotubes
3. Single-wall carbon nanotube (SWCNT) functionalized Sn–Ag–Cu lead-free composite solders
4. Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn–Cu intermetallic compound layers
5. Research advances in nano-composite solders
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1. Performance assessment of Sn-based lead-free solder composite joints based on extreme learning machine model tuned by Aquila optimizer;Journal of Alloys and Compounds;2024-01
2. Materials Modification of Lead-Free Solder Alloys with Different Reinforcing Components;Springer Proceedings in Physics;2023
3. A review on nanodispersed lead-free solders in electronics: synthesis, microstructure and intermetallic growth characteristics;Journal of Materials Science;2022-05
4. Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish;Journal of Materials Science: Materials in Electronics;2022-03-07
5. Surface Modifications on Ceramic Reinforcement for Tin-Based Composite Solders;Recent Progress in Lead-Free Solder Technology;2022
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