Improving the performance of lead-free solder reinforced with multi-walled carbon nanotubes
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference11 articles.
1. Lead-free Solders in Microelectronics
2. Proceedings of the 1997 IEEE International Symposium on Electronics and the Environment;Gibson,1997
3. Synthesis of Al/SiC based functionally gradient materials using technique of gradient slurry disintegration and deposition: effect of stirring speed
4. Tin–lead (SnPb) solder reaction in flip chip technology
5. Calculation of surface tension and wetting properties of Sn-Based solder alloys
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