Enhancement of Ge-based p-channel vertical FET performance by channel engineering using planar doping and a Ge/Si x Ge1–x–y Sn y heterostructure model for low power FET applications
Author:
Publisher
IOP Publishing
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
http://iopscience.iop.org/article/10.1088/1361-6641/aae001/pdf
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1. Experimental comparison between relaxed and strained Ge pFinFETs
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3. Performance and electrostatic improvement by high-pressure anneal on Si-passivated strained Ge pFinFET and gate all around devices with superior NBTI reliability
4. Demonstration of Ge Nanowire CMOS Devices and Circuits for Ultimate Scaling
5. Fully Depleted Ge CMOS Devices and Logic Circuits on Si
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1. Performance and reliability assessment of source work function engineered charge plasma based Ti/HfO2/Al2O3/Ge, double gate TFET;Engineering Research Express;2024-05-03
2. Influence of charge traps on charge plasma-germanium double-gate TFET for RF/Analog & low-power switching applications;Microelectronics Reliability;2024-02
3. Investigating the effects of doping gradient, trap charges, and temperature on Ge vertical TFET for low power switching and analog applications;Materials Science and Engineering: B;2024-01
4. Design and analysis of a dual gate tunnel FET with InGaAs source pockets for improved performance;Microelectronics Journal;2022-11
5. Design and Simulation of Si and Ge Double-Gate Tunnel Field-Effect Transistors with High-κ Al2O3 Gate Dielectric: DC and RF Analysis;Lecture Notes in Electrical Engineering;2022-09-12
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