Conduction mechanisms of the reverse leakage current of 4H-SiC Schottky barrier diodes
Author:
Publisher
IOP Publishing
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
http://iopscience.iop.org/article/10.1088/1361-6641/aaf8cb/pdf
Reference30 articles.
1. Design and optimization of junction termination extension (JTE) for 4H–SiC high voltage Schottky diodes
2. Current SiC technology for power electronic devices beyond Si
3. Material science and device physics in SiC technology for high-voltage power devices
4. Reverse leakage current calculations for SiC Schottky contacts
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1. Conduction mechanism of Schottky contacts fabricated on etch pits originating from single threading dislocation in a highly Si-doped HVPE GaN substrate;Materials Science in Semiconductor Processing;2023-11
2. 4H–SiC floating junction Schottky barrier diode with compensation layer of engineered cathode structure: Cone-shaped electric field, current density waveform, and applications;Microelectronics Journal;2022-07
3. Numerical analysis of the GaN trench MIS barrier Schottky diodes with high dielectric reliability and surge current capability;AIP Advances;2022-06-01
4. Exploration of switching characteristics of 4H-SiC floating junction Schottky barrier diodes with stronger blocking voltage capability;Journal of Power Electronics;2021-07-12
5. A Highly Sensitive and Robust GaN Ultraviolet Photodetector Fabricated on 150-mm Si (111) Wafer;IEEE Transactions on Electron Devices;2021-06
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