Modeling and Analysis of TSV Arrays with Different Ground and Signal Distributions in 2.5D/3D Integration Systems
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy
Link
http://stacks.iop.org/1742-6596/1087/i=5/a=052019/pdf
Reference10 articles.
1. Electromigration failure in a copper dual-damascene structure with a through silicon via
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