The FE-I4 pixel readout system-on-chip resubmission for the insertable B-Layer project-Reference-Cited by-同舟云学术

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The FE-I4 pixel readout system-on-chip resubmission for the insertable B-Layer project

Published:2012-02-24 Issue:02 Volume:7 Page:C02050-C02050
ISSN:1748-0221
Container-title:Journal of Instrumentation
language:
Short-container-title:J. Inst.

Author:

Zivkovic V,Schipper J-D,Garcia-Sciveres M,Mekkaoui A,Barbero M,Darbo G,Gnani D,Hemperek T,Menouni M,Fougeron D,Gensolen F,Jensen F,Caminada L,Gromov V,Kluit R,Fleury J,Krüger H,Backhaus M,Fang X,Gonella L,Rozanov A,Arutinov D

Publisher

IOP Publishing

Subject

Mathematical Physics,Instrumentation

Reference5 articles.

1. Development of a versatile and modular test system for ATLAS hybrid pixel detectors

2. The design for test architecture in digital section of the ATLAS FE-I4 chip

Cited by 15 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Search for an axion-like particle with forward proton scattering in association with photon pairs at ATLAS;Journal of High Energy Physics;2023-07-31

2. Observation and Measurement of Forward Proton Scattering in Association with Lepton Pairs Produced via the Photon Fusion Mechanism at ATLAS;Physical Review Letters;2020-12-23

3. Pixel readout chip software emulators for the YARR DAQ system upgrade;Journal of Physics: Conference Series;2018-09

4. Production and integration of the ATLAS Insertable B-Layer;Journal of Instrumentation;2018-05-16

5. A UVM simulation environment for the study, optimization and verification of HL-LHC digital pixel readout chips;Journal of Instrumentation;2018-05-14

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