First production of new thin 3D sensors for HL-LHC at FBK
Author:
Publisher
IOP Publishing
Subject
Mathematical Physics,Instrumentation
Link
http://stacks.iop.org/1748-0221/12/i=01/a=C01022/pdf
Reference12 articles.
1. Physics potential and experimental challenges of the LHC luminosity upgrade
2. The geometrical dependence of radiation hardness in planar and 3D silicon detectors
3. Prototype ATLAS IBL modules using the FE-I4A front-end readout chip
4. 3D silicon sensors: Design, large area production and quality assurance for the ATLAS IBL pixel detector upgrade
5. Characterization of the first double-sided 3D radiation sensors fabricated at FBK on 6-inch silicon wafers
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