Characterization of the first double-sided 3D radiation sensors fabricated at FBK on 6-inch silicon wafers
Author:
Publisher
IOP Publishing
Subject
Mathematical Physics,Instrumentation
Link
http://stacks.iop.org/1748-0221/10/i=12/a=C12009/pdf
Reference17 articles.
1. 3D silicon sensors: Design, large area production and quality assurance for the ATLAS IBL pixel detector upgrade
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3. Physics potential and experimental challenges of the LHC luminosity upgrade
4. Comparative measurements of highly irradiated n-in-p and p-in-n 3D silicon strip detectors
5. Radiation hardness tests of double-sided 3D strip sensors with passing-through columns
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