Progress on TSV technology for Medipix3RX chip

Author:

Sarajlić M.,Pennicard D.,Smoljanin S.,Fritzsch T.,Zoschke K.,Graafsma H.

Publisher

IOP Publishing

Subject

Mathematical Physics,Instrumentation

Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Detector developments for photon science at DESY;Frontiers in Physics;2024-01-03

2. A Study on Fine-Pitch Convertors for Radiation Detectors with Interposers as an Alternative to Through Silicon Via Technology;2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC);2022-09-13

3. Characterisation of the HEXITEC4S X-ray spectroscopic imaging detector incorporating through-silicon via (TSV) technology;Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment;2022-02

4. 3D TSV hybrid pixel detector modules with ATLAS FE-I4 readout electronic chip;Journal of Instrumentation;2022-01-01

5. Medipix3 proton and carbon ion measurements across full energy ranges and at clinical flux rates in MedAustron IR1;Journal of Instrumentation;2021-12-01

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