A Study on Fine-Pitch Convertors for Radiation Detectors with Interposers as an Alternative to Through Silicon Via Technology

Author:

Schneider Andreas1,Beckett Dan1,Ghorbanian Navid1,Cross Simon P.1,Veale Mathew C.1,Wilson Mathew D.1,Hart Mathew1,Lipp John D.1,French Marcus J.1

Affiliation:

1. Technology Science and Technology Facilities Council (STFC), Rutherford Appleton Laboratory (RAL),Didcot,UK

Publisher

IEEE

Reference30 articles.

1. Indium bump deposition techniques on wafers and individual die chips for flip-chip bonding of hybrid X-ray detectors;schneider;unpublished accepted for 23rd Int Workshop on Radiation Imaging Detectors (IWORID 2022),2022

2. A hgh dynamic range pixel readout in a Si-Ge process;zimmerman;presentation at Front End Electronics Conference,0

3. Pixellated Cd(Zn)Te high-energy X-ray instrument

4. Medipix3: A 64k pixel detector readout chip working in single photon counting mode with improved spectrometric performance

5. HEXITEC ASIC—a pixellated readout chip for CZT detectors

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