Multi-step reaction mechanism for F atom interactions with organosilicate glass and SiOxfilms-Reference-Cited by-同舟云学术

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Multi-step reaction mechanism for F atom interactions with organosilicate glass and SiOxfilms

Published:2016-07-28 Issue:34 Volume:49 Page:345203
ISSN:0022-3727
Container-title:Journal of Physics D: Applied Physics
language:
Short-container-title:J. Phys. D: Appl. Phys.

Author:

Mankelevich Yuri A,Voronina Ekaterina N,Rakhimova Tatyana V,Palov Alexander P,Lopaev Dmitry V,Zyryanov Sergey M,Baklanov Mikhail R

Funder

Russian Scientific Fund (RSF)

Publisher

IOP Publishing

Subject

Surfaces, Coatings and Films,Acoustics and Ultrasonics,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://stacks.iop.org/0022-3727/49/i=34/a=345203/pdf

Reference61 articles.

1. Surface science aspects of etching reactions

2. Fluorocarbon plasma etching and profile evolution of porous low-dielectric-constant silica

3. Etching mechanisms of low-k SiOCH and selectivity to SiCH and SiO[sub 2] in fluorocarbon based plasmas

4. Etching of xerogel in high-density fluorocarbon plasmas

5. Etching mechanisms of Si and SiO2in fluorocarbon ICP plasmas: analysis of the plasma by mass spectrometry, Langmuir probe and optical emission spectroscopy

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