An approach for the prediction of interfacial delamination of an a-Si3N4 /Si bilayer system-Reference-Cited by-同舟云学术

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An approach for the prediction of interfacial delamination of an a-Si3N4 /Si bilayer system

Published:2016-08-09 Issue:36 Volume:49 Page:365301
ISSN:0022-3727
Container-title:Journal of Physics D: Applied Physics
language:
Short-container-title:J. Phys. D: Appl. Phys.

Author:

Lin Pamela,Meng Chai Chee,Xue Ming,Xu Huan,Zhou Kun

Funder

Ministry of Education - Singapore

Economic Development Board - Singapore

Publisher

IOP Publishing

Subject

Surfaces, Coatings and Films,Acoustics and Ultrasonics,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://stacks.iop.org/0022-3727/49/i=36/a=365301/pdf

Reference53 articles.

1. Demystifying 3D ICs: The Pros and Cons of Going Vertical

2. Cross-sectional nanoindentation: a new technique for thin film interfacial adhesion characterization

3. Failure Mechanisms in Ceramic-Fiber/Ceramic-Matrix Composites

4. Interfacial toughness measurements for thin films on substrates

5. Four-point bend adhesion measurements of copper and permalloy systems

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1. Nanoindentation and scratching behaviors of diamond-like carbon films by coarse-grained molecular dynamics;Diamond and Related Materials;2023-12

2. Insight into the Mechanical Properties and Fracture Behavior of Pt3Al Coating by Experiment and Theoretical Simulation;Journal of Materials Engineering and Performance;2021-03-15

3. Mixed mode interfacial crack energy estimation of glass interposer and SiNx coatings by using fracture mechanics based computer methods and experimental validations;Theoretical and Applied Fracture Mechanics;2018-08

4. The development of estimated methodology for interfacial adhesion of semiconductor coatings having an enormous mismatch extent;Applied Surface Science;2018-05

5. Characterization of interfacial delamination in multi-layered integrated circuit packaging;Surface and Coatings Technology;2017-06

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