Four-point bend adhesion measurements of copper and permalloy systems-Reference-Cited by-同舟云学术

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Four-point bend adhesion measurements of copper and permalloy systems

Published:2004-01 Issue:2 Volume:71 Page:245-261
ISSN:0013-7944
Container-title:Engineering Fracture Mechanics
language:en
Short-container-title:Engineering Fracture Mechanics

Author:

Hughey Michael P.,Morris Dylan J.,Cook Robert F.,Bozeman Steven P.,Kelly Brian L.,Chakravarty Srinivas L.N.,Harkens David P.,Stearns Laura C.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference25 articles.

1. Role of passivation etch polymers in interfacial delamination for polymeric low-k dielectrics;Breen;J. Vac. Sci. Technol. B,2000

2. The foundations of magnetic recording;Mallinson,1993

3. Adhesion and debonding of multi-layer thin film structures;Dauskardt;Eng. Fract. Mech.,1998

4. A test specimen for determining the fracture resistance of bimaterial interfaces;Charalambides;J. Appl. Mech.,1989

5. Interface crack between two elastic layers;Suo;Int. J. Fract.,1990

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