Surface processes in low-pressure capacitive radio frequency discharges driven by tailored voltage waveforms-Reference-Cited by-同舟云学术

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Surface processes in low-pressure capacitive radio frequency discharges driven by tailored voltage waveforms

Published:2020-07-13 Issue:7 Volume:29 Page:074001
ISSN:1361-6595
Container-title:Plasma Sources Science and Technology
language:
Short-container-title:Plasma Sources Sci. Technol.

Author:

Derzsi A^ORCID,Horváth B^ORCID,Donkó Z^ORCID,Schulze J^ORCID

Funder

Hungarian Academy of Sciences

US NSF

Hungarian National Research, Development and Innovation Office

German Research Foundation

NewNational Excellence Program of the Ministry for Innovation and Technology

Publisher

IOP Publishing

Subject

Condensed Matter Physics

Link

https://iopscience.iop.org/article/10.1088/1361-6595/ab9156/pdf

Reference127 articles.

1. Principles of Plasma Discharges and Materials Processing

2. Plasma Electronics

3. Physics of Radio-Frequency Plasmas

4. Modeling of Si Etching Under Effects of Plasma Molding in Two-Frequency Capacitively Coupled Plasma in $\hbox{SF}_{6}/\hbox{O}_{2}$ for MEMS Fabrication

5. Foundations of low-temperature plasma enhanced materials synthesis and etching

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