Atomic structures and electronic properties of Ni or N modified Cu/diamond interface
Author:
Funder
National Natural Science Foundation of China
Shanghai Pujiang Program
Publisher
IOP Publishing
Subject
Condensed Matter Physics,General Materials Science
Link
https://iopscience.iop.org/article/10.1088/1361-648X/ab686b/pdf
Reference41 articles.
1. Synthesis and characterization of the diamond/copper composites produced by the pulse plasma sintering (PPS) method
2. A novel method for metal–diamond composite coating deposition with cold spray and formation mechanism
3. Thermal shock resistance and thermal conductivity of diamond-Cu composite coatings on Cu substrate via mechanical milling method
4. Tailoring interface structure and enhancing thermal conductivity of Cu/diamond composites by alloying boron to the Cu matrix
5. Understanding the thermal conductivity of Diamond/Copper composites by first-principles calculations
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